| 摘要 |
PROBLEM TO BE SOLVED: To provide the semiconductor module of high production efficiency improved in the reliability of a connection with an external wafer. SOLUTION: This semiconductor module is provided with a wiring board 2 on which wiring 3 is formed, a semiconductor device 1 electrically connected with wiring formed on the wring board, and an external connecting terminal 5 which is arranged on the side of the wiring board packaging the semiconductor device for a connecting portion with the outside electrically connected with wiring and between the wiring board and the external connecting terminal. An insulating resin layer 10 thicker than the semiconductor device is formed.
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