| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a semiconductor package which eliminates the need for a test socket, corresponding to the package size, and to provide the semiconductor package. SOLUTION: A resin sheet, formed in steps S1 to S7, is half-cut in a step S8 to part the lead frame of the resin sheet. Respective semiconductor chips of the resin sheet, which becomes electrically independent have their electrical characteristics tested, while still in the resin sheet, as it is. In a step S11, the resin sheet is divided into pieces of semiconductor packages. |
