| 摘要 |
PROBLEM TO BE SOLVED: To reduce sizes and cost of a module type semiconductor device, to reduce riskiness of bending an external terminal, and to reduce sizes of a unit mounted with the module type semiconductor device. SOLUTION: A package for the module type semiconductor device comprises a cover 43 having a recess 5 formed at its central part to be below than a peripheral edge, and an electronic component 31 mounted on a circuit substrate 3 and partly housed in the recess 5 to reduce the height of the component 31. |
