发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To form structure which restrains oxidation of a contact plug connected with a lower electrode and prevents the lower electrode from falling down, when the lower columnar electrode of a capacitor is formed by an electroplating method. SOLUTION: This method includes a process for forming a silicon nitride film 109 composed of an insulator on an interlayer insulating film and a contact plug, a process for forming a ruthenium film 110 on the silicon nitride film 109, a process for forming a silicon oxide film 111 composed of an insulator on the ruthenium film 110, a process for forming an aperture 112 penetrating the silicon nitride film 109, the ruthenium film 110 and the silicon oxide film 111, a process for embedding an electrode material and forming the lower electrode 113 in the aperture part 112 by an electroplating method, a process for eliminating the silicon oxide film 111 selectively, and a process for eliminating the ruthenium film 110 on the silicon nitride film 109.
申请公布号 JP2003031688(A) 申请公布日期 2003.01.31
申请号 JP20010217225 申请日期 2001.07.17
申请人 TOSHIBA CORP 发明人 KIYOTOSHI MASAHIRO;YAMAZAKI SOICHI
分类号 C25D5/02;C25D7/12;H01L21/288;H01L21/8242;H01L21/8246;H01L27/105;H01L27/108 主分类号 C25D5/02
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