| 摘要 |
PROBLEM TO BE SOLVED: To provide bonding wire for semiconductor devices which can be smoothly unwound from its spool even if it is stored for a long time from its manufacture until it is used by a client and to provide a method for manufacturing it. SOLUTION: The bonding wire for semiconductor devices is subjected to a coating process at least before wire drawing or after heat treatment so that its forward contact angle with respect to purified water may be 80 deg. or more after it is subjected to wire drawing and heat treatment. |
