| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit package which is improved so that multiplication of pins of a semiconductor package is realized without changing a pin pitch. SOLUTION: In a semiconductor package, external leads 11 and 12 are placed around the package in the top and bottom two steps or more in vertical direction. By placing an external connecting terminal for supplying power and inputting-outputting a control signal and data signal from an IC mounted on the semiconductor package, not only in a step around the package but also in two steps or more around the package, the external connecting terminal is prepared without forming fine pin pitch.</p> |
