| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a surface acoustic wave device with a small size at a low cost and with excellent productivity. SOLUTION: The manufacturing method includes at least a step of generating a plurality of surface acoustic wave elements by forming come-line electrodes on one major side of a piezoelectric substrate, a step of arranging a plurality of the surface acoustic wave elements by opposing one major side to an aggregate of flat base substrates and applying flip-chip connection of a plurality of the surface acoustic wave elements to the aggregate of the base substrate via a bump at a prescribed interval, a step of sealing a plurality of the surface acoustic wave elements by pressing and heating a sealing resin sheet to a side opposed to the one major side of a plurality of the surface acoustic wave elements, and a step of slitting the seal resin sheet and the aggregate of the base substrates at the same time so as to separate the seal body by each surface acoustic wave elements. Depressing and heating the seal resin sheet allows the seal resin to intrude the gap of the surface acoustic wave elements so as to seal a plurality of the surface acoustic wave elements subjected to flip-chip connected to the aggregate of the base substrates at the same time. |
