| 摘要 |
PROBLEM TO BE SOLVED: To reduce weight, and to improve heat-radiating properties and packaging reliability for the manufacturing method of a module, having a process for dividing the module into individual pieces by a blade, and to provide the module manufactured by the method. SOLUTION: In the manufacturing method, where a sealing resin 12 is formed on a substrate 10 with an electronic component being packaged for sealing the electronic component, and cutting treatment is conducted in a specific cutting line 13 for manufacturing a module 20 which is divided into individual pieces, a wide blade 14 is used for half-cutting the cutting line for complete cutting of the half-cut section 15 by a blade 16 narrower than the wide plate 14. |
