FLIP CHIP MOUNTING BODY AND METHOD OF MOUNTING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a flip chip mounting body and a method of mounting the same flip chip to realize easier management of a gap between a chip and circuit substrate and also stable electrical connection between the chip and circuit substrate. SOLUTION: The flip chip mounting body comprises the circuit substrate 4 including a conductive part 5 and the chip 1 including a solder part 3, in which the conductive part 5 and solder part 3 are provided opposed to each other and are electrically connected. The conductive part 5 is formed as projected electrodes 5a to 5g in which at least a part thereof enters the solder part 5 of the chip 1 to realize electrical connection between the circuit substrate 4 and chip 1.