MICROPARTICLE ALIGNMENT CONDUCTIVE CONNECTION FILM, MANUFACTURING METHOD OF THE MICROPARTICLE ALIGNMENT CONDUCTIVE CONNECTION FILM AND CONDUCTIVE CONNECTION STRUCTURAL BODY

摘要

PROBLEM TO BE SOLVED: To provide a microparticle alignment conductive connection film, a manufacturing method of the microparticle alignment conductive connection film and a conductive connection structural body which can readily make electrical connections of high connection reliability in a short time, without leakage of adjacent electrodes. SOLUTION: The fine particle alignment conductive connection film has conductive particles, arranged at any positions of an adhesive film laminated body, and is structured by an adhesive film with both sides coated with mold- releasing films, and at least a part of the conductive microparticles are exposed from the adhesive film.