| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component assemble that can increase the density of a main substrate and can improve workability. SOLUTION: This electronic component assembly includes the main substrate 10, a first wiring pattern 11 formed on the substrate 10, and a second wiring pattern 12 formed on the substrate 10 and divided into sections by the first wiring pattern 11. This assembly also includes first lands 12a and 12b, respectively connected to the end sections of the divided sections of the second wiring pattern 12, an auxiliary substrate 20 mounted on the main substrate 10, and a third wiring pattern 23 formed on the substrate 20. In addition, this assembly also includes second lands 23a and 23b, respectively connected to the end sections of the third wiring pattern 23 and conductor members, which electrically connects the first lands 12a and 12b to the second lands 23a and 23b.
|
