| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling structure for semiconductor element that can prevent water infiltration into a semiconductor element even when a cooling liquid leaks out. SOLUTION: This cooling structure 10 for semiconductor element is provided with a cooling liquid space 12 for storing the cooling liquid and an insulating substrate 14 mounted on the space 12, so that the substrate 14 may directly come into contact with the cooling liquid stored in the space 12. A semiconductor module 18 containing the semiconductor element 16 constituted as a heating element is bonded to the upper surface of the substrate 14. The cooling liquid stored in the space 12 is sealed by means of the substrate 14 through a sealing material 20, and the module 18 is cooled by the cooling liquid through the substrate 14. When the cooling liquid leaks out due to the deterioration, etc., of the sealing material 20, the leaking-out cooling liquid 22 is collected in a leaking-out cooling liquid collecting groove 24 and discharged to the outside through a leaking-out cooling liquid discharge pipe 26. Consequently, the leaking- out cooling liquid 22 can be prevented from infiltrating into the semiconductor module 18.
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