| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device and a packaging structure for the same with which a soldering quality is improved by relaxing thermal stress in the case of performing reflow soldering, in the semiconductor device of low heat resistance with which the reflow temperature of a Ball Grid Array(BGA) package, for example, is set comparatively low. SOLUTION: In the semiconductor device with which a semiconductor element is loaded on the upper surface and a carrier is provided on the lower surface for locating a plurality of component electrodes in the shape of grid at prescribed intervals, the carrier is equipped with a shield part for reflecting or absorbing infrared light, while keeping a prescribed interval with the semiconductor element and converting the upper surface of the semiconductor element at least.</p> |
