GOLD WIRE BONDING METHOD, DEVICE AND SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide a method, a device and a system for gold wire bonding by which a gold wire is bonded at a lower temperature, especially at a room temperature defined as 25 deg.C. SOLUTION: The gold wire bonding device for bonding the gold wire 303 to a gold bonding pad 307 is provided with a holder 301 for supporting the gold wire 303, a source 309 of vibration for vibrating the holder 301 on frequencies below 200 kHz and on power below 1 W and a source 390 of pressure for pressing the holder 301 against the gold bonding pad 307.