| 摘要 |
PROBLEM TO BE SOLVED: To constitute a lead forming device that does not shave off plated layers formed on the surfaces of the leads of a semiconductor package at the time of bending the leads to have a small size and a simple control mechanism and to use a small number of parts. SOLUTION: When a punch 18 is lowered to a die 19, a pair of package retaining pins 14 fixes a package 9 to a package receiving die 8 and a pair of lead bending punches 13 starts to bend the leads 10 of the package 9. Since a pair of cam pushers 11a pushes down cam stoppers 4a, cam slides 7 and lower driving cams 5 synchronously to the bending operation, follower rollers 1a are pushed outward. The follower rollers 1a and rotary slide dies 3 are respectively connected to each other through connecting members 3a and can rotate around supporting points (shafts) 2a. Consequently, the slide dies 3 move inward as shown by the arrows. Therefore, the front end sections of the leads do not rub the upper surfaces of the slide dies 3.
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