发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To prevent damages to an air spindle, even in cases like instantaneous power failure or power failure, or decline in the pressure of compressed air. SOLUTION: When an instantaneous power failure or a power failure is detected in a commercial power supply by a detector 3, power is automatically switched to power for backup which is generated by an uninterruptible power supply 2; and at the same time, a drive mechanism for a stage to be mounted with a semiconductor wafer is stopped, and the air spindle is moved upward to a safe place to protect a semiconductor wafer. A spindle inverter 7, which is supplied with the power for backup of the uninterruptible power supply 2 forcibly stops the air spindle 6. Furthermore, when the reduction in pressure of compressed air at the plant side is detected by a pressure sensor 4, a spare air tank 5 switches the compressed air on the factory side to compressed air of the spare air tank 5 and then supplies it to the air spindle 6.
申请公布号 JP2003031525(A) 申请公布日期 2003.01.31
申请号 JP20010210545 申请日期 2001.07.11
申请人 HITACHI LTD;AKITA DENSHI SYSTEMS:KK 发明人 OGASAWARA JUNYA
分类号 F15B20/00;H01L21/301;(IPC1-7):H01L21/301 主分类号 F15B20/00
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