| 摘要 |
PROBLEM TO BE SOLVED: To realize a ceramic multilayer board by enabling the thick film intaglio transfer on the surface of green ceramic GS, without forming adhesive layer on the green ceramic GS. SOLUTION: Using a conductor paste material or a green ceramic GS material, containing a larger quantity of resin binder than that of the conventional conductor paste or green ceramic GS, an intaglio is filled with the conductor paste and then the green ceramic GS is heated and pressured to improve the bondability of a conductor film with the green ceramic GS sufficient for eliminating transfer failures after the intaglio transfer, as well as to suppress the internal rupture of the green ceramic GS. The intaglio, filled with the conductor paste, is coated with an adhesive layer to improve the bondability of the green ceramic GS, thereby suppressing transfer failures, after the intaglio transfer. |
