| 摘要 |
PROBLEM TO BE SOLVED: To reduce the mutual interference between a plurality of metallic bases to an ignorable degree and, in addition, to make the metallic bases deformable to such a degree that the bases can be adhered closely to a cooling body, in a large-capacity semiconductor device in which unit modules constituted by mounting semiconductor chips on circuit boards are bonded to the surfaces of the metallic bases. SOLUTION: In each metallic base 5, for example, slits 7 having widths which are almost equal to the thickness of the base 5 are provided among three unit modules 1, 2, and 3 respectively constituting the U-, V- and W-phases of a three-phase bridge and fixed on the base 5. Then the projecting sections 45 of a resin-made encapsulating case frame 4 are inserted into the slits 7 and, at the same time, the frame 4 is bonded to the base 5. |
