| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board which is superior in reliability of layer insulation layers. SOLUTION: The wiring board, composed of a plurality of wiring circuit conductor layers and insulation layers each provided between the conductor layers, comprises an insulation layer 8 covering a first wiring circuit conductor layer 7 on the board 6, and an insulation layer 9 inserted on the insulation layer 8. The layer 9 contains a metal powder 11 and is inserted with the powder 11, partly exposed to form nuclei for forming a copper foil layer on the metal powder 11 by copper plating. The copper foil layer, by copper playing, is adhered tightly to the insulation layer 9 sufficiently to attain the purpose. |
