| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device which has a sufficient lifetime and high reliability and which can reduce the defect ratio and to provide a method for manufacturing the same. SOLUTION: The semiconductor light emitting device comprises a mounting member 10, and semiconductor light emitting element chips 1 to 4 installed on the member 10 and including nitride compound semiconductors in such a manner that main surfaces of the chips 1 to 4 each has a curved surface. Thus, shapes of the chips 1 to 4 installed on the member 10 are adapted that the main surfaces of the chips 1 to 4 each consciously has a curved surface (in a warped state) and hence the lifetime of the emitting device can be prolonged. Thus, the shapes of the chips 1 to 4 after mounting are managed, and thereby the defective ratio of the emitting device can be reduced, and reliability of the device can be improved. |
