DEVICE AND METHOD FOR MOUNTING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a mounting method/device of an electronic component, which can mount a high end electronic component, having bumps of a narrow pitch. SOLUTION: The abutment of the solder bumps 1b of the electronic component 1, sucked and held by the suction nozzle 11 of a head tool 3, and abuttment of the soldered parts 2 of a circuit board 4 is detected. The solder bumps 1b and soldered parts 2 are melted through heating. Suction and holding to the electronic component 1 by the suction nozzle 11 of the head tool 3 is released not during the melting of solder, but is conducted after cooling and caking of solder.