| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mounting structure of semiconductor device and a method of mounting the same semiconductor device in which a bump electrode of a semiconductor element is connected to substrate wiring on a circuit substrate, and the substrate wiring coupled to the bump electrode is largely deformed to assure electrical connection at the connecting part, while a gap between the semiconductor element and substrate wiring is formed thinner to improve reliability of connection at the terminal of the semiconductor element. SOLUTION: The mounting structure of semiconductor device comprises insulating sealing resin 3, a circuit substrate 7 where thermosetting bonding agent 5 is provided between a basic material and substrate wiring 4, a semiconductor element 1 where a plurality of bump electrodes 2 are formed, and connecting part for electrically connecting on the face-down basis the semiconductor element 1 to the substrate wiring via the sealing resin 3. The substrate wiring 4 to be in contact with the bump electrode 2 of semiconductor element is largely deformed at the connecting part by removing the thermosetting bonding agent 5, while the gap between semiconductor element and substrate wiring is formed thinner up to 0.2 times or less the height of bump at the terminal of the semiconductor element.</p> |
