| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package which assures an easier and stable sealing process and also provide a method of manufacturing the same package. SOLUTION: A semiconductor package comprises a tape substrate 5 in which wirings are provided on the front surface thereof, a bump 3, a supporting member 4, and a semiconductor chip 1 provided on the tape substrate 5 via the bump 3 and supporting member 4. The bump 3 is electrically connected to the wirings of tape substrate 5 but the supporting member 4 is not electrically connected to the wirings on the tape substrate. |
