发明名称 CONDUCTIVELY CONNECTING FILM WITH DISPOSED PARTICLES, ITS MANUFACTURING METHOD AND CONDUCTIVELY CONNECTING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide an conductively connecting film with disposed particles, capable of easily carrying out electrical connection having no leakage of adjacent electrodes and high connection reliability in a short time when conductively connecting fine electrodes facing each other in plural electronic components, in a conductively connecting structure, a method for manufacturing it, and the conductively connecting structure. SOLUTION: In this conductively connecting film with disposed particles, the conductive particles are disposed in through holes opened in an adhesive film. The conductive particles are at least partially exposed from the adhesive film, and are disposed only at positions corresponding to the electrode parts facing each other in an electronic component.
申请公布号 JP2003031281(A) 申请公布日期 2003.01.31
申请号 JP20010218326 申请日期 2001.07.18
申请人 SEKISUI CHEM CO LTD 发明人 FUKUOKA MASATERU;IUCHI KENJI
分类号 B32B7/02;C09J7/00;C09J9/02;H01B5/00;H01B5/16;H01B13/00;H01R11/01;H01R43/00;H05K3/32;H05K3/36;(IPC1-7):H01R11/01 主分类号 B32B7/02
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