MAGNETIC HEAD ASSEMBLY

摘要

PROBLEM TO BE SOLVED: To prevent the deterioration in soldering quality after joining again when there is a need for peeling the electrical connection of a wiring FPC previously subjected to wiring connection and a circuit board fixed to a carriage and loaded with a preamplifier IC and joining both again. SOLUTION: The wiring FPC is peeled from the junctures of the wiring FPC and the circuit board and the copper core remaining on the circuit board is removed without oxidation of a solder at a heating temperature (<=150 deg.C) at which the solder is not melted by a tool to be exclusively used without melting the solder. The solder necessary for rejoining is made to remain at >=50% and in the case of gold tin joining, the rejoining is performed while the growth of the gold tin alloy is suppressed. The number of peeling and rejoining times of the wiring FPC and the circuit board at >=4 times is made possible with the joining quality equivalent to the initial joining in the rejoining and soldering quality. The easy removal of the copper core at the temperature at which the solder is not melted by the tool to be exclusively used is made possible and the skill of work can be reduced.