Chip-on-board module, and method of manufacturing the same

摘要

A chip-on-board module has a multilayer interconnection board having die mount sections; dies mounted on respective die mount sections such that a single die is mounted on each die mount section or two or more dies are being stacked and mounted there; bonding pads provided on the multilayer and connected to single dies or uppermost dies; contact pads provided on the multilayer board and connected to corresponding bonding pads; jumper pads provided in proximity to the contact pads and connected to edge terminals of the multilayer board, circuit elements mounted on the multilayer interconnection board, or through holes formed so as to extend across layers of the multilayer board; and molding resin for molding the dies and the pads. The uppermost dies of the respective die mount sections where dies are stacked in two or more layers have passed an electric property test.