| 摘要 |
<p>A ceramic connection body effectively used for a semiconductor manufacturing and inspecting device including a hot plate, a method of connecting the ceramic bodies to each other, and a ceramic structural body, the ceramic connection body formed of ceramic bodies connected to each other wherein coarse pores having an average diameter larger than the average particle size of ceramic particles forming the ceramic body and 2000 μm or less are formed in a connection boundary surface between one ceramic body and the other ceramic body.</p> |
