| 摘要 |
<p>A device and a method for scribing a fragile material substrate, the method comprising the step of forming a crack along a predicted scribe line (SL) by continuously cooling a cooled spot (CP) near a heated area while heating the surface of the fragile material substrate (50) by a laser spot (LS) at a temperature lower than the softening point of the fragile material substrate (50) along an area where a scribe line is formed, wherein an initial crack (TR) is formed in the fragile material substrate at a position where the initial crack is expected to be formed along the predicted scribe line (SL) after the position is heated by the laser spot (LS) and before or after the position is cooled by the cooling spot (CP).</p> |
