DEVICE AND METHOD FOR SCRIBING FRAGILE MATERIAL SUBSTRATE

摘要

A device and a method for scribing a fragile material substrate, the method comprising the step of forming a crack along a predicted scribe line SL by continuously cooling a cooled spot CP near a heated area while heating the surface of the fragile material substrate 50 by a laser spot LS at a temperature lower than the softening point of the fragile material substrate 50 along an area where a scribe line is formed, wherein an initial crack TR is formed in the fragile material substrate at a position where the initial crack is expected to be formed along the predicted scribe line SL after the position is heated by the laser spot LS and before or after the position is cooled by the cooling spot CP.