发明名称 |
Oled packaging |
摘要 |
An improved method of fabricating a device such as OLED is disclosed. The method includes applying an adhesive on a cap or substrate. The adhesive is partially cured to initiate the cross-linking process while remaining in the liquid phase. The cap is then mounted onto the substrate and the adhesive is cured to encapsulate the device. By partially curing the adhesive prior to mounting the cap, the curing of the adhesive can be achieved without prolonged exposure to UV radiation or high temperatures which can adversely impact the device.
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申请公布号 |
US2003019572(A1) |
申请公布日期 |
2003.01.30 |
申请号 |
US20010915803 |
申请日期 |
2001.07.26 |
申请人 |
LOW HONG YEE;CHUA SOO JIN;GUENTHER EWALD KARL MICHAEL |
发明人 |
LOW HONG YEE;CHUA SOO JIN;GUENTHER EWALD KARL MICHAEL |
分类号 |
H05B33/04;H01L21/50;H01L23/10;H01L51/50;H01L51/52;H05B33/02;H05B33/10;(IPC1-7):B32B31/00 |
主分类号 |
H05B33/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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