发明名称 Method and structure for forming metallic interconnections using directed thermal diffusion
摘要 Energy is applied to a portion of a conducting body. In preferred embodiments, relative motion between the conducting body and the energy source is created such that the energy source moves along a thermal diffusion front, thereby enhancing the thermal diffusion front in the direction of the relative movement. The energy is preferably applied in a portion of the conducting body with higher thermal mass and the enhanced thermal diffusion front is directed toward a portion with lower thermal mass. The lower thermal mass portion expands, thereby creating fissures in surrounding material, then melts, flows through the fissures and contacts another conductor, thereby forming a conductive link.
申请公布号 US2003019851(A1) 申请公布日期 2003.01.30
申请号 US20010916533 申请日期 2001.07.30
申请人 DUEWEKE MICHAEL 发明人 DUEWEKE MICHAEL
分类号 B23K26/22;C21D1/34;H01L21/00;H01L21/60;H01L23/525;H01R4/02;H01R43/02;(IPC1-7):B23K26/00 主分类号 B23K26/22
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