ISOLATION TECHNIQUE FOR PRESSURE SENSING STRUCTURE

摘要

A pressure sensor (100) in accordance with the invention comprises a die (101) having pressure-sensing electrical components formed in a first side (101b) of the die (101). In one embodiment, a method of securing a cap (119) to silicon die (101) is provided comprising forming a thin glass particle layer (702 on a bonding area (119c) of the cap (119), heating the cap (119) and the thin glass particle layer (702) on the bonding area (119c) to form a substantially continuous glass layer (702) on the bonding area (119c), and heating the cap (119) and silicon die (101) to a temperature above the melting point of the glass to form a bond between the cap (119) and the silicon die (101).