| 发明名称 |
DECOUPLING CAPACITOR FOR INTEGRATED CIRCUIT PACKAGE AND ELECTRICAL COMPONENTS USING THE DECOUPLING CAPACITOR AND ASSOCIATED METHODS |
| 摘要 |
A capacitive structure is made with thin film capacitor plates (32) substantially surrounding an opening cavity (30) for accommodating a chip. The capacitive structure includes at least one capacitor and is mounted around the periphery of a ball grid array "BGA" (14) having a flip chip (18) in the opening. The capacitive structure provides a high capacitance with a low parasitic inductance.
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| 申请公布号 |
WO03009389(A1) |
申请公布日期 |
2003.01.30 |
| 申请号 |
WO2002US17265 |
申请日期 |
2002.06.04 |
| 申请人 |
THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ARKANSAS |
发明人 |
SCHAPER, LEONARD, W. |
| 分类号 |
H01L23/36;H01L23/50;H01L23/64;(IPC1-7):H01L29/00;H01L23/34 |
主分类号 |
H01L23/36 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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