Electronic component comprises a semiconductor chip and a wiring plate connected to the active surface of the chip using a double-sided adhering film

摘要

Electronic component comprises a semiconductor chip (2) and a wiring plate (3). The surface of the wiring plate is connected to the active surface (5) of the chip using a double-sided adhering film (6). Electronic component comprises a semiconductor chip (2) and a wiring plate (3). The surface of the wiring plate is connected to the active surface (5) of the chip using a double-sided adhering film (6). The wiring plate has a metal layer (9) structured in wiring lines (8) on its lower side (7). Each wiring line has a bond end (10) and an outer contact surface (11). Each wiring line has a solder stop surface (12) on its transition to the bond end and/or on its transition to the outer contact surface. Independent claims are also included for the following: (1) a system support for several electronic components; a process for the production of the system support; and (2) a process for the production of the electronic component.