Land grid array package mounting apparatus for testing semiconductor device package, has cam for moving bending plate and for bending each contact finger which passes through the bending plate

摘要

A cam (65) moves a bending plate (60) laterally with respect to a support base (25) and a guide plate (21), and bends each contact finger (40) to adjust the distance between free ends (42,44) of the contact fingers. The bending plate has an aperture (61) corresponding to guides (22,26). Several axially elongated contact fingers pass through the aperture of plate. An Independent claim is also included for electrical contact establishment method between package and circuit board.