Chemical mechanical polishing slurry containing abrasive particles exhibiting photocatalytic function

摘要

There is provided a method of manufacturing a semiconductor device, including irradiating a chemical mechanical polishing slurry with light on applying a chemical mechanical polishing treatment using the slurry to a polishing section of a target substrate to be polished, the slurry containing a dispersion medium and abrasive particles dispersed in the dispersion medium and exhibiting a photocatalytic function upon irradiation with light.