发明名称 |
IMPROVED METAL FRAME FOR ELECTRONIC HARDWARE AND FLAT PANEL DISPLAYS |
摘要 |
A metal frame for electronic hardware and a method of manufacturing such a frame wherein at least a portion of the frame is made of bulk-solidifying amorphous alloys or bulk-solidifying amorphous alloy-composites is provided. The metal frames of the invention are preferably made of bulk-forming amorphous alloys or bulk-forming amorphous alloy- composites having an elastic limit for the metal frame of at least about 1.5%, and preferably greater than about 2.0%, a ΔTsc of more than 30°C, and at least one of the following properties: a hardness value of about 4 GP A or more, and preferably 5.5 GPA or more; a yield strength of about 2 GPa or more; a fracture toughness of about 10 ksi-sqrt(in) (sqrt:squre root) or more, and preferably 20 ksi sqrt(in) or more; and a density of at least 4.5 g/cc or more. |
申请公布号 |
WO03009088(A2) |
申请公布日期 |
2003.01.30 |
申请号 |
WO2002US18129 |
申请日期 |
2002.06.07 |
申请人 |
LIQUID METAL TECHNOLOGIES;PEKER, ATAKAN;JOHNSON, WILLIAM, L. |
发明人 |
PEKER, ATAKAN;JOHNSON, WILLIAM, L. |
分类号 |
B22D11/00;A47B81/00;C21D6/00;C22C14/00;C22C16/00;C22C33/00;C22C45/02;C22C45/10;C22F1/00;H05K5/00;H05K5/02;H05K5/04 |
主分类号 |
B22D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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