| 摘要 |
The invention relates to a support for electrical circuit elements that, for electrically connecting circuit elements by soldering, bonding or gluing, is comprised of a structured base body or is coated with structures consisting of easily oxidizing metals that have a multilayer, electrically conductive covering, which is inert on the outer surface, prevents a migration of the easily oxidizing metals, and has good soldering, bonding or adhering properties. The covering has the following composition: a) a first single ply or multiply layer that serves as an adhesive/barrier layer; b) a second single ply or multiply layer that serves as a functional layer for soldering, bonding or gluing, and; c) a third single ply or multiply layer, which is placed on the outer surface of the covering and which has inert properties and a high surface energy. |
