发明名称 Perimeter seal for backside cooling of substrates
摘要 An apparatus, typically a sealing member extending around the periphery of a substrate support or chuck, seals an individual substrate with respect to a substrate support, typically in a processing chamber. The seal is of a corrugated shape, that enhances clamping forces, typically from electrostatic or mechanical clamps, to provide a seal between it and the substrate, for example a wafer.
申请公布号 US2003021077(A1) 申请公布日期 2003.01.30
申请号 US20020163567 申请日期 2002.06.06
申请人 KENNEY MARK D. 发明人 KENNEY MARK D.
分类号 H01L21/00;(IPC1-7):H02N13/00 主分类号 H01L21/00
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