| 发明名称 |
Intergrated circuit chip bonding sheet and integrated circuit package |
| 摘要 |
An IC chip bonding sheet having adhesive resin layers formed on both faces of a porous polytetrafluoroethylene layer comprising a porous polytetrafluoroethylene sheet, the porous polytetrafluoroethylene layer retaining porous voids, and the adhesive resin layers comprising a bromine-free flame retardant resin composition.
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| 申请公布号 |
US2003020178(A1) |
申请公布日期 |
2003.01.30 |
| 申请号 |
US20020175141 |
申请日期 |
2002.06.19 |
| 申请人 |
OHASHI KAZUHIKO;YOKOMIZO OSAMU;YOSHIDA KOJI |
发明人 |
OHASHI KAZUHIKO;YOKOMIZO OSAMU;YOSHIDA KOJI |
| 分类号 |
C08K3/00;C08K5/00;C09J7/02;C09J201/00;H01L21/52;H01L21/58;H01L23/12;(IPC1-7):B32B3/26 |
主分类号 |
C08K3/00 |
| 代理机构 |
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代理人 |
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