| 摘要 |
PURPOSE: A lead frame of a semiconductor package is provided to remove easily a mold flash generated from a transfer molding process by forming a metal layer on a surface of a ball land. CONSTITUTION: A lead(20) is extended from four sides of a paddle(10). A semiconductor chip is adhered on a surface of the paddle(10). A surface of the lead(20) is connected electrically with a bond pad of the semiconductor chip by using a metal wire. A ball land(21) is formed by etching selectively a bottom portion of the lead(20). A transfer molding process is performed before a solder ball is mounted on the ball land(21). The transfer molding process is to mold a sealant on an upper region of the lead frame. A metal layer(30) is formed on the ball land(21). |
