| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is excellent in adhesive properties and resistances to repeated flexing, heat, and moisture and is used for flexible printed circuit board materials including a flexible printed circuit substrate, a cover lay material, and a bonding sheet; and a flexible printed circuit substrate, a cover lay material, and a bonding sheet prepared by using the composition. SOLUTION: This epoxy resin composition contains (a) an epoxy resin, (b) a curing agent, (c) a phenolic-hydroxyl-group-containing polyamide- poly(butadiene-acrylonitrile)copolymer, (d) an ion scavenger, and (e) a heavy metal deactivator.
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