3D-Semiconductor Package

摘要

A semiconductor package is provided which enables various interconnections between pins at a low cost. In an embodiment of the invention, the semiconductor package has a base substrate and a group of IC's (spacer IC's, routing IC's, and flip chip IC's) stacked on the base substrate in three dimensions. The routing IC is an interposer for wiring between the pins of the chips located above and below the routing IC and enables the integration of passive elements.