发明名称 METHOD AND DEVICE FOR LASER CUTTING MICROSCOPIC SAMPLES
摘要 <p>The invention relates to a method and a device for laser cutting microscopic samples. The device for laser cutting microscopic samples comprises a microscope (1) having at least one lens (6) for observing a sample (12) that is to be cut The lens (6) defines an optical axis (14) and a lens aperture (34). A laser (4) is also connected to the microscope (1). The laser (4) generates a laser beam (41) that is injected into the lens (6) by means of at least one optical system (16). A diaphragm (18) is provided, which generates a dimmed laser beam (4b), whereby the laser aperture (36) generated by the lens (6) is smaller than the lens aperture (34) of the lens (6) itself.</p>
申请公布号 EP1279016(A1) 申请公布日期 2003.01.29
申请号 EP20010940151 申请日期 2001.04.10
申请人 LEICA MICROSYSTEMS WETZLAR GMBH 发明人 GANSER, MICHAEL;WEISS, ALBRECHT;STENZEL, RUEDIGER
分类号 G01N1/06;B23K26/00;B23K26/066;G01N1/04;G01N1/28;G02B21/32;(IPC1-7):G01N1/04;B23K26/06 主分类号 G01N1/06
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