| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin layer laminate structure wherein such a problem that when a resin layer, i.e., an insulating layer is made thinner for a resin coated copper foil, the inter-layer insulation cannot be ensured by a heat-pressing process due to the effect of the roughened surface form of the copper foil is eliminated, and the insulating property can be ensured even when the insulating layer is made thinner in spite of the fact that the insulating property of the front and rear copper foils has not been ensured even when the insulating layer having a thickness of several times larger than the surface roughness Rz of the copper foil roughened surface is applied. SOLUTION: A heat-resistant film, especially an aromatic polyamide film is inserted in an adhesive resin layer which is filled in a space between confronted copper foils. Thus, this thin layer laminate wherein the insulating property between the copper foils can be ensured even when the insulating layer is made extremely thin can be manufactured. Also, a multi-layer wiring board containing the thin layer laminated body obtained in such a manner can be provided. |
