发明名称 METHOD AND DEVICE FOR PRINTING PATTERN
摘要 PROBLEM TO BE SOLVED: To perform a printing without bringing a printing plate into contact with a substrate for preventing the substrate from being stained through the contact with the printing plate at the printing of the pattern of an electronic part or the like with an ink on the substrate. SOLUTION: Printing with non-contact of the substrate with the printing plate can be realized by blasting the ink from an ink blasting mask against the substrate by a method wherein a high pressure gas is used after the charging of the ink in the ink blasting mask, on which a through pattern is formed or the pressure on the substrate side of the ink blasting mask is temporarily made lower as compared with the pressure on the opposite side of the substrate.
申请公布号 JP2003025706(A) 申请公布日期 2003.01.29
申请号 JP20010213501 申请日期 2001.07.13
申请人 KANDA SHINJI 发明人 KANDA SHINJI
分类号 B41M1/12;H05K1/03;H05K3/46;(IPC1-7):B41M1/12 主分类号 B41M1/12
代理机构 代理人
主权项
地址