| 摘要 |
PROBLEM TO BE SOLVED: To provide an inexpensive resin sealing device capable of reducing stress received when a package is ejected, and a resin sealing method using the same. SOLUTION: The resin sealing device is equipped with lower and upper molds 1 and 2 opposed to each other, a cavity 9 provided to the upper mold 2 to receive the injection of a molten resin, and a thin plate part 10 provided so as to constitute the bottom surface of the cavity 9 and having an initial shape protruding toward the cavity 9. The thin plate 10 is pressed by resin pressure at the time of injection of the molten resin into the cavity to be deformed until it becomes almost parallel to the upper surface of a substrate 13, and returned to the initial shape at the time of opening of the lower and upper molds 1 and 2 to press the almost entire upper surface of a seal resin 15. By this constitution, the stress received by the package is uniformized to be reduced. Further, since the package 7 is ejected by the deformation of the molds themselves, the molds are simplified in structure. |
