发明名称 Fast temperature profile assessment of thick walled components
摘要 <p>The invention refers to an improved method, a system and a computer program product (CPP), which, based on at least one acquired fluid temperature (Tfluid), allow a fast computation respectively a fast monitoring of temperatures profiles (TP) of thick walled components (TWC). A computer unit (CU) collects temperature signal data, corresponding to an acquired fluid temperature (Tfluid). Based on said temperature signal data, said computer program product (CPP) computes a temperature derivative estimation ( DIFFERENTIAL Tnew/ DIFFERENTIAL t), with respect to time (t) of a temperature of the thick walled component (TWC). Said computer program product (CPP) discretises said temperature derivative estimation ( DIFFERENTIAL Tnew/ DIFFERENTIAL t) and solves a system of m ordinary differential equations resulting in a known temperature derivative estimation ( DIFFERENTIAL Tnew/ DIFFERENTIAL t). Said computer program product (CPP) computes said known temperature derivative estimation ( DIFFERENTIAL Tnew/ DIFFERENTIAL t) in a computation of a temperature diffusion law. Said computer program product (CPP) solves a system of m*n algebraic equations with respect to radius (r) and length (z) of the thick walled component (TWC) for obtaining a first variant of a temperature profile (TP) and/or said computer program product (CPP) solves m systems of n algebraic equations with respect to radius (r) of the thick walled component (TWC) for obtaining a second variant of a temperature profile (TP). &lt;IMAGE&gt;</p>
申请公布号 EP1279937(A1) 申请公布日期 2003.01.29
申请号 EP20010810731 申请日期 2001.07.24
申请人 ABB RESEARCH LTD. 发明人 GALLESTEY, EDUARDO;STOTHERT, ALEC;MORTON, STEVE
分类号 G01K3/10;G01K7/02;G01K7/42;G01N25/18;(IPC1-7):G01K7/02;G01N25/20 主分类号 G01K3/10
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