| 摘要 |
<p>PURPOSE: To provide a thermosetting resin composition which is useful for an undercoat, etc., of a printed circuit board, etc., gives a cured film containing no air bubble, and has an easily polishable surface; and a smooth printed circuit board, etc. CONSTITUTION: This resin composition contains (I) an adduct of an epoxy resin and an unsaturated fatty acid, (II) a methacrylate, (III) a free-radical polymerization initiator, (IV) a crystalline epoxy resin, and (V) a latent curing agent.</p> |
