| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device capable of speedily controlling a taper of a polished body largely both in variation and a control range of the taper of the polished body and constantly at temperature of a surface plate in polishing of a wafer as the polished body. SOLUTION: A surface of a pressure head 12 facing against a polishing plate 16 formed on a convexly curved surface on the polishing device to polish the polished body such as the semi-conductor wafer 18, etc., fixed on the polishing plate 16 held on the pressure head 12 by pressing it on a polishing pad 14 on the surface plate 10 and rotating the surface plate 10 or the polishing plate 16. |
